Devices and Structures

Bibliographic References tagged with Devices and Structures

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D. Wang, S. G. Thomas, K. L. Wang, Y. Xia, and G. M. Whitesides. 1997. “Nanometer Scale Patterning and Pattern Transfer on Amorphous Si, Crystalline Si, and SiO2 Surfaces Using Self-Assembled Monolayers”. Applied Physics Letters, 70, Pp. 1593-95
D. Wang, S. G. Thomas, K. L. Wang, Y. Xia, and G. M. Whitesides. 1997. “Nanometer Scale Patterning and Pattern Transfer on Amorphous Si, Crystalline Si, and SiO2 Surfaces Using Self-Assembled Monolayers”. Applied Physics Letters, 70, Pp. 1593-95
W. S. Beh, I. T. Kim, D. Qin, Y. Xia, and G. M. Whitesides. 1999. “Formation of Patterned Microstructures of Conducting Polymers by Soft Lithography and Applications in Microelectronic Device Fabrication”. Advanced Materials, 11, Pp. 1038-41
W. S. Beh, I. T. Kim, D. Qin, Y. Xia, and G. M. Whitesides. 1999. “Formation of Patterned Microstructures of Conducting Polymers by Soft Lithography and Applications in Microelectronic Device Fabrication”. Advanced Materials, 11, Pp. 1038-41
J. Aizenberg, J. A. Rogers, K. E. Paul, and G. M. Whitesides. 1997. “Imaging the Irradiance Distribution in the Optical Near Field”. Applied Physics Letters, 71, Pp. 3773-75
J. Aizenberg, J. A. Rogers, K. E. Paul, and G. M. Whitesides. 1997. “Imaging the Irradiance Distribution in the Optical Near Field”. Applied Physics Letters, 71, Pp. 3773-75
B. A. Grzybowski, S. T. Brittain, and G. M. Whitesides. 1999. “Thermally Actuated Interferometric Sensors Based on the Thermal Expansion of Transparent Elastomeric Media”. Rev. Sci. Instrum., 70, Pp. 2031-37
B. A. Grzybowski, S. T. Brittain, and G. M. Whitesides. 1999. “Thermally Actuated Interferometric Sensors Based on the Thermal Expansion of Transparent Elastomeric Media”. Rev. Sci. Instrum., 70, Pp. 2031-37
D. Qin, Y. Xia, and G. M. Whitesides. 1997. “Elastomeric Light Valves”. Advanced Materials, 9, Pp. 407-10
D. Qin, Y. Xia, and G. M. Whitesides. 1997. “Elastomeric Light Valves”. Advanced Materials, 9, Pp. 407-10
X-M. Zhao, Y. Xia, and G. M. Whitesides. 1996. “Fabrication of Three-Dimensional Micro-Structures: Microtransfer Molding”. Advanced Materials, 8, Pp. 837-40
X-M. Zhao, Y. Xia, and G. M. Whitesides. 1996. “Fabrication of Three-Dimensional Micro-Structures: Microtransfer Molding”. Advanced Materials, 8, Pp. 837-40
R. J. Jackman and G. M. Whitesides. 1999. “Electrochemistry and Soft Lithography: A Route to 3-D Microstructures”. ChemTech , 29, Pp. 18-30
R. J. Jackman and G. M. Whitesides. 1999. “Electrochemistry and Soft Lithography: A Route to 3-D Microstructures”. ChemTech , 29, Pp. 18-30
M. Mrksich, L. E. Dike, J. Tien, D. E. Ingber, and G. M. Whitesides. 1997. “Using Microcontact Printing to Pattern the Attachment of Mammalian Cells to Self-Assembled Monolayers of Alkanethiolates on Transparent Films of Gold and Silver”. Experimental Cell Research, 235, Pp. 305-13
M. Mrksich, L. E. Dike, J. Tien, D. E. Ingber, and G. M. Whitesides. 1997. “Using Microcontact Printing to Pattern the Attachment of Mammalian Cells to Self-Assembled Monolayers of Alkanethiolates on Transparent Films of Gold and Silver”. Experimental Cell Research, 235, Pp. 305-13
E. Kim, G. M. Whitesides, L. K. Lee, S. P. Smith, and M. G. Prentiss. 1996. “Fabrication of Arrays of Channel Waveguides by Three-Dimensional Self-Assembly Using Patterned Organic Monolayers As Templates”. Adv. Mat., 8, Pp. 139-42
E. Kim, G. M. Whitesides, L. K. Lee, S. P. Smith, and M. G. Prentiss. 1996. “Fabrication of Arrays of Channel Waveguides by Three-Dimensional Self-Assembly Using Patterned Organic Monolayers As Templates”. Adv. Mat., 8, Pp. 139-42
D. C. Duffy, O. J. A. Schueller, S. T. Brittain, and G. M. Whitesides. 1999. “Rapid Prototyping of Microfluidic Switches in Poly(dimethyl Siloxane) and Their Actuation by Electroosmotic Flow”. J. Micromechan. Microeng., 9, Pp. 211-17
D. C. Duffy, O. J. A. Schueller, S. T. Brittain, and G. M. Whitesides. 1999. “Rapid Prototyping of Microfluidic Switches in Poly(dimethyl Siloxane) and Their Actuation by Electroosmotic Flow”. J. Micromechan. Microeng., 9, Pp. 211-17